Microhardness of bulk and higher density nanocrystalline copper obtained by hot compaction

Xiangcheng Sun, R. Reglero, Xiukui Sun, M. Jose Yacaman

Research output: Contribution to journalArticlepeer-review

17 Scopus citations


Nanocrystalline copper (Cu) samples with relatively higher density (>98.5%) and smaller grain size (20-50 nm), have been prepared by gas-condensation technique with subsequent in-situ hot compaction using a novel consolidation device. It is found that Vickers microhardness of all as-synthesized nanocrystalline copper samples compacted under the different pressure (1.0-3.5 GPa) at 423 K (0.315 Tm) are greater than those of coarse grained Cu (50 μm). No significant grain growth is observed. However, the hardness appears to increase with increasing grain size ranging from 20±0.12 nm to 24.8±0.12 nm, in contrast, the normal Hall-Petch relation between 20±0.15 nm and 50±0.15 nm under the same density are indicated. This complicated result is attributed to higher density, smaller grain size and internal microstrains of samples.

Original languageEnglish (US)
Pages (from-to)82-87
Number of pages6
JournalMaterials Chemistry and Physics
Issue number1
StatePublished - Feb 14 2000
Externally publishedYes

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics


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