Initial results on the development of A new wafer inspection paradigm

A new paradigm for wafer inspection is being developed that would resolve many pending issues of -wafer inspection today. This paradigm integrates 1) a DRAM fabrication line simulation model, producing synthetic images of "Epical" wafer maps and associated defects to, 2) fuzzy clustering/declustering algorithms that identify various defects, and 3) a unique defect tracking mechanism to monitor patterns of defects across wafer maps. This approach holds promise for in-line process control by allowing for off-site analysis of fabrication line problems and unsupervised adaptation and optimization of application-specific inspection algorithms. The paper reports on the progress made towards the fulfilment of this paradigm.