Abstract
Atomic force microscopy was used to monitor, in situ, the shape evolution of polycrystalline copper during anodic dissolution in 0.5M H2SO4. During dissolution of the copper surface under a small anodic potential (30 mV), an overlayer of material that resulted from mechanical polishing was removed, exposing the underlying grain boundaries. A chemically etched sample was exposed to the same experimental conditions, and no overlayer was observed. Dissolution of the copper bulk metal was monitored under a higher applied potential (100 mV, 0.5M H2SO4). The overlayer was immediately removed, and the dissolution produced a nonuniform, crystallographically-etched surface. The inhibiting effect of benzotriazole (BTA) on copper dissolution in 0.5M H2SO4/20 mM BTA was observed. Copper dissolution did not proceed at 100 mV or 200 mV applied potential; but at 300 mV, rapid localized dissolution resulted in the formation of pit-like features.
Original language | English (US) |
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Pages (from-to) | 2829-2832 |
Number of pages | 4 |
Journal | Journal of the Electrochemical Society |
Volume | 139 |
Issue number | 10 |
DOIs | |
State | Published - Oct 1992 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Renewable Energy, Sustainability and the Environment
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrochemistry
- Materials Chemistry