Dynamic conductance characteristics in HfOx-based resistive random access memory

  • Ying Chen Chen
  • , Yao Feng Chang
  • , Xiaohan Wu
  • , Fei Zhou
  • , Meiqi Guo
  • , Chih Yang Lin
  • , Cheng Chih Hsieh
  • , Burt Fowler
  • , Ting Chang Chang
  • , Jack C. Lee

Research output: Contribution to journalArticlepeer-review

39 Scopus citations

Abstract

Characteristics of HfOx-based resistive switching memory (RRAM) in Al/HfOx/Al and Al/AlOx/HfOx/Al structures were studied using a dynamic conductance method. Step-like RESET behaviors as well as pre- and post-RESET regions of operation were characterized. The results indicated that defects at the oxide interface caused cycling issues in the Al/AlOx/HfOx/Al structure. No such RESET behavior was observed for the Al/HfOx/Al structure. Current induced over-heating, which caused an early RESET event, could be avoided using current-sweep technique that caused less electrical and thermal stress in localized regions. The experimental results not only provided insights into potential reliability issues and power management in HfOx-based RRAM, but also helped clarifying the resistive switching mechanisms.

Original languageEnglish (US)
Pages (from-to)12984-12989
Number of pages6
JournalRSC Advances
Volume7
Issue number21
DOIs
StatePublished - 2017
Externally publishedYes

ASJC Scopus subject areas

  • General Chemistry
  • General Chemical Engineering

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