3D nanofabrication on complex seed shapes using glancing angle deposition

Hyeon Ho Jeong; Andrew G. Mark; John G. Gibbs; Thomas Reindl; Ulrike Waizmann; Jurgen Weis; Peer Fischer

doi:10.1109/MEMSYS.2014.6765670

3D nanofabrication on complex seed shapes using glancing angle deposition

Hyeon Ho Jeong, Andrew G. Mark, John G. Gibbs, Thomas Reindl, Ulrike Waizmann, Jurgen Weis, Peer Fischer

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

Three-dimensional (3D) fabrication techniques promise new device architectures and enable the integration of more components, but fabricating 3D nanostructures for device applications remains challenging. Recently, we have performed glancing angle deposition (GLAD) upon a nanoscale hexagonal seed array to create a variety of 3D nanoscale objects including multicomponent rods, helices, and zigzags [1]. Here, in an effort to generalize our technique, we present a step-by-step approach to grow 3D nanostructures on more complex nanoseed shapes and configurations than before. This approach allows us to create 3D nanostructures on nanoseeds regardless of seed sizes and shapes.

Original language	English (US)
Title of host publication	MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	437-440
Number of pages	4
ISBN (Print)	9781479935086
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765670
State	Published - 2014
Externally published	Yes
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States Duration: Jan 26 2014 → Jan 30 2014

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Country/Territory	United States
City	San Francisco, CA
Period	1/26/14 → 1/30/14

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMSYS.2014.6765670

Cite this

Jeong, H. H., Mark, A. G., Gibbs, J. G., Reindl, T., Waizmann, U., Weis, J., & Fischer, P. (2014). 3D nanofabrication on complex seed shapes using glancing angle deposition. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems (pp. 437-440). Article 6765670 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2014.6765670

3D nanofabrication on complex seed shapes using glancing angle deposition. / Jeong, Hyeon Ho; Mark, Andrew G.; Gibbs, John G. et al.
MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. p. 437-440 6765670 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Jeong, HH, Mark, AG, Gibbs, JG, Reindl, T, Waizmann, U, Weis, J & Fischer, P 2014, 3D nanofabrication on complex seed shapes using glancing angle deposition. in MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems., 6765670, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 437-440, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, CA, United States, 1/26/14. https://doi.org/10.1109/MEMSYS.2014.6765670

Jeong HH, Mark AG, Gibbs JG, Reindl T, Waizmann U, Weis J et al. 3D nanofabrication on complex seed shapes using glancing angle deposition. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2014. p. 437-440. 6765670. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2014.6765670

Jeong, Hyeon Ho ; Mark, Andrew G. ; Gibbs, John G. et al. / 3D nanofabrication on complex seed shapes using glancing angle deposition. MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 437-440 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{f04bfd703e054d34ae160eb1ec681b9d,

title = "3D nanofabrication on complex seed shapes using glancing angle deposition",

abstract = "Three-dimensional (3D) fabrication techniques promise new device architectures and enable the integration of more components, but fabricating 3D nanostructures for device applications remains challenging. Recently, we have performed glancing angle deposition (GLAD) upon a nanoscale hexagonal seed array to create a variety of 3D nanoscale objects including multicomponent rods, helices, and zigzags [1]. Here, in an effort to generalize our technique, we present a step-by-step approach to grow 3D nanostructures on more complex nanoseed shapes and configurations than before. This approach allows us to create 3D nanostructures on nanoseeds regardless of seed sizes and shapes.",

author = "Jeong, {Hyeon Ho} and Mark, {Andrew G.} and Gibbs, {John G.} and Thomas Reindl and Ulrike Waizmann and Jurgen Weis and Peer Fischer",

year = "2014",

doi = "10.1109/MEMSYS.2014.6765670",

language = "English (US)",

isbn = "9781479935086",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "437--440",

booktitle = "MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems",

note = "27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 ; Conference date: 26-01-2014 Through 30-01-2014",

}

TY - GEN

T1 - 3D nanofabrication on complex seed shapes using glancing angle deposition

AU - Jeong, Hyeon Ho

AU - Mark, Andrew G.

AU - Gibbs, John G.

AU - Reindl, Thomas

AU - Waizmann, Ulrike

AU - Weis, Jurgen

AU - Fischer, Peer

PY - 2014

Y1 - 2014

N2 - Three-dimensional (3D) fabrication techniques promise new device architectures and enable the integration of more components, but fabricating 3D nanostructures for device applications remains challenging. Recently, we have performed glancing angle deposition (GLAD) upon a nanoscale hexagonal seed array to create a variety of 3D nanoscale objects including multicomponent rods, helices, and zigzags [1]. Here, in an effort to generalize our technique, we present a step-by-step approach to grow 3D nanostructures on more complex nanoseed shapes and configurations than before. This approach allows us to create 3D nanostructures on nanoseeds regardless of seed sizes and shapes.

AB - Three-dimensional (3D) fabrication techniques promise new device architectures and enable the integration of more components, but fabricating 3D nanostructures for device applications remains challenging. Recently, we have performed glancing angle deposition (GLAD) upon a nanoscale hexagonal seed array to create a variety of 3D nanoscale objects including multicomponent rods, helices, and zigzags [1]. Here, in an effort to generalize our technique, we present a step-by-step approach to grow 3D nanostructures on more complex nanoseed shapes and configurations than before. This approach allows us to create 3D nanostructures on nanoseeds regardless of seed sizes and shapes.

UR - http://www.scopus.com/inward/record.url?scp=84898986131&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84898986131&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2014.6765670

DO - 10.1109/MEMSYS.2014.6765670

M3 - Conference contribution

AN - SCOPUS:84898986131

SN - 9781479935086

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 437

EP - 440

BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014

Y2 - 26 January 2014 through 30 January 2014

ER -

3D nanofabrication on complex seed shapes using glancing angle deposition

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this